Application:

・   　　Server

Features:

・        Solder Ball, SMT Soldering

・        Approved by Intel

Specification:

　 Mechanical:

・        Pitch: 0.508 (X) ×0.8814mm (Y)

・        Contact Count: 2011 Pin

・        Durability: 30 Cycles 　

   Electrical:

・        Current Rating: Min. 0.5A / Pin

・        Contact Resistance: Max. 22mΩ (Initial & Final)

   Physical:

・        Housing: Thermoplastic, black, 

・        Cover Cap: Thermoplastic, black

・        Contact: High-strength copper alloy

          Plating: Min. 30u” nickel under plated over all;

                              selective gold plated on contact area;

                              Matte-tin on solder tail

・　　　 Lever: Stainless steel

・　　　 Force Frame and Stiffener Frame: Stainless steel                               

・        Solder Ball: Sn/Ag/Cu alloy for lead-free type

・　　　 Operating Temperature: -25℃~105℃

    Packaging:

・        Hard Tray

　 Order Information:

・        CPU Socket : AZIF0001-P00**

・        BP: DCA-HSK-182-***